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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 237
Datasheet Volume One
Package Mechanical Specifications
9 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that
interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package
consists of a processor mounted on a substrate land-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating
surface for processor component thermal solutions, such as a heatsink. Figure 9-1
shows a sketch of the processor package components and how they are assembled
together. Refer to the
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product
Families Thermal/Mechanical Design Guide for complete details on the LGA2011-0 land
FCLGA10 socket.
The package components shown in Figure 9-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and baseboard are included for reference and are not part of processor package.
9.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 9-2 and Figure 9-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
Figure 9-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
TIM
LGA2011-0 Socket
Die
- Datasheet - Volume One 1
- Contents 3
- Datasheet Volume One 10
- Revision History 11
- 1 Overview 13
- Overview 14
- 1.2 Interfaces 15
- 1.2.2 PCI Express* 16
- Transaction 18
- 1.3 Power Management Support 19
- 1.5 Package Summary 20
- 1.6 Terminology 20
- 1.7 Related Documents 23
- 1.8 State of Data 24
- 2 Interfaces 25
- 2.2 PCI Express* Interface 26
- 2.2.1.1 Transaction Layer 27
- 2.2.1.2 Data Link Layer 27
- 2.2.1.3 Physical Layer 27
- 2.3.1 DMI2 Error Flow 28
- 2.3.3 DMI2 Link Down 28
- Interfaces 29
- 2.5.2 Client Command Suite 31
- 2.5.2.2 GetDIB() 32
- Reserved 33
- # of Domains 33
- Byte# 5 33
- 2.5.2.3 GetTemp() 34
- 2.5.2.4 RdPkgConfig() 35
- 2.5.2.5 WrPkgConfig() 36
- Channel Temperature Data 43
- 816232431 43
- DRAM Power Limit Performance 45
- CPU ID Data 49
- 2.5.2.7 RdIAMSR() 60
- 2.5.2.8 RdPCIConfig() 64
- 2.5.2.9 RdPCIConfigLocal() 65
- 2.5.2.10 WrPCIConfigLocal() 67
- 2.5.3.1 Power-up Sequencing 69
- 2.5.3.2 Device Discovery 70
- 2.5.3.3 Client Addressing 70
- 2.5.3.4 C-states 71
- 2.5.3.5 S-states 72
- 2.5.3.6 Processor Reset 72
- 2.5.5.1 Abort FCS 75
- 2.5.5.2 Completion Codes 75
- 2.5.7.1 Format 76
- 2.5.7.2 Interpretation 76
- 2.5.7.3 Temperature Filtering 77
- 3 Technologies 79
- 3.1.2 Intel VT-x Features 80
- 3.1.3 Intel VT-d Objectives 80
- 3.2 Security Technologies 81
- (Intel® AES-NI) 82
- 3.2.4 Execute Disable Bit 83
- 4 Power Management 87
- Table 4-6. Intel QPI States 89
- 4.2.2 Low-Power Idle States 90
- 4.2.4.2 Core C1/C1E State 92
- 4.2.4.1 Core C0 State 92
- 4.2.4.3 Core C3 State 93
- 4.2.4.4 Core C6 State 93
- 4.2.4.5 Core C7 State 93
- 4.2.4.6 C-State Auto-Demotion 93
- 4.2.5 Package C-States 94
- 4.2.5.1 Package C0 95
- 4.2.5.2 Package C1/C1E 95
- 4.2.5.3 Package C2 State 96
- 4.2.5.4 Package C3 State 96
- 4.2.5.5 Package C6 State 96
- 4.3.2.1 Self Refresh Entry 98
- 4.3.2.2 Self Refresh Exit 98
- 4.3.2.3 DLL and PLL Shutdown 99
- 5 Thermal Management 101
- Platform 125
- 4600 Product Family 127
- 5.2.1 Processor Temperature 138
- 5.2.2.2 Clock Modulation 140
- 5.2.5 THERMTRIP_N Signal 141
- 6 Signal Descriptions 143
- 6.5 PECI Signal 147
- 6.7 JTAG and TAP Signals 147
- Miscellaneous Signals 148
- 7 Electrical Specifications 153
- 7.1.9.2 Decoupling Guidelines 156
- 7.2 Signal Group Summary 160
- 7.5 Mixing Processors 165
- AP-485, Intel® Processor 166
- 7.8 DC Specifications 168
- Core Supply, Processor 170
- Current on V 170
- Figure 7-3. 8/6-Core: V 172
- • 0-135 A for 95 W processor 173
- 7.8.2.1 V 175
- Overshoot Specifications 175
- Time [us] 176
- Unit Figure Notes 178
- O_ABS_MAX 181
- 7.9 Signal Quality 183
- 7.9.5.3 Activity Factor 185
- Specifications 185
- 8 Processor Land Listing 187
- Processor Land Listing 188
- 8.2 Listing by Land Number 212
- 9 Package Mechanical 237
- 9.7 Processor Materials 242
- 9.8 Processor Markings 242
- 10.1 Introduction 243
- Keepout Zones 245
- PWM Control 254
- Frequency Range 254
- 21,000 25,000 28,000 Hz 254
- 10.4 Boxed Processor Contents 256
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